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AVC Advanced Very-Low-Voltage CMOS Logic Data Book, March 2000 (Rev. C)

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Factors That Influence Side-Wetting Performance on IC Terminals

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Thermal Derating Curves For Logic-Products Packages (Rev. B)

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Understanding Thermal Dissipation and Design of a Heatsink

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Use of Surftape Carrier Tape to Ship TI Bare Die and Small Packages

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Simultaneous-Switching Performance of TI Logic Devices (Rev. B)

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Electrostatic Discharge (ESD) Protective Semiconductor Packing Materials and Con (Rev. A)

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High-Performance Backplane Design With GTL (Rev. A)

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Electromagnetic Emission From Logic Circuits

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Comparison of Electromagnetic Interference Potential of Integrated Logic Circuit

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Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP)

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Thin Very Small-Outline Package (TVSOP) Application Report (Rev. E)

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Designing With TI SN74V2x5 FIFO Programmable Flags

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Thermal Characteristics of SLL Packages and Devices (Rev. B)

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Package Thermal Characterization Methodologies

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Manual (pdf)

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Printed Circuit Board Layout for Improved Electromagnetic Compatibility

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Medium-Pin-Count Surface-Mount Package Information (Rev. B)

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Metastability Performance Of Clocked FIFOs (Rev. A)

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Seamless Processor Interface Using FIFO Bus Matching And Byte Swapping

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